🖥️ DISPLAY VIEW:
1. WAFER PLAN VIEW (300mm Top-View) Coordinate System: WAFER RELATIVE ℹ️
2. NOZZLE TRACE & FOOTPRINT Chamber Fixed Position | Wafer Trace: Circular
3. RADIAL FILM THICKNESS PROFILE
Cursor r: r: 75 mm | h: 182.6 µm
RADIAL CURSOR INSPECTOR (r = 75 mm) [Drag cursor on graph to inspect]
Radius 75 mm
Film Thickness 182.6 µm
Chemical Blend DIW 60 / IPA 40
Viscosity (μ) 1.15 cP
Surface Tension (σ) 58.2 mN/m
Flow Velocity (u) 84.5 mm/s
Reynolds No. (Re) 1.21 × 10⁶
Flow Regime Turbulent
Dewetting Status Stable
Marangoni Effect 0.042 mm/s
Center (0mm)
742.1 µm
25mm
512.4 µm
50mm
298.7 µm
75mm
182.6 µm
100mm
112.3 µm
125mm
61.8 µm
Edge (150mm)
24.7 µm
4. WAFER CROSS SECTION (Side View) Vertical thickness is visually amplified.
Max Thickness
742.1 µm
@ r (mm)
0.0
Edge Thickness
24.7 µm
Avg Thickness
184.3 µm
Re @ Edge
1.21 × 10⁶
Regime
Turbulent
💡 노즐 구조물을 좌우로 드래그하면 X 위치가 실시간 변경됩니다
Uniformity--%
Avg Film-- µm
DewettingStable
RPM1000
Temp25°C
MIXED PROPERTIES (Flow-Weighted)
ρmix: 0.91 g/cc
μmix: 1.47 cP
σmix: 55.3 mN/m
Local Equilibrium Properties
EDGE FORCE DOMINANCE
Centrifugal >> Viscous > Marangoni
Engineering Screening Indicator
EDGE EVAPORATION
LOW
Temp & RPM Screening Indicator
MARANGONI EFFECT
MEDIUM
uM Screening: 0.042 mm/s
MODEL CONFIDENCE
MEDIUM
Reduced-Order LUB-2D Model
📊 V13.4-3 고급 300 mm 웨이퍼 액막 균일도 분석 (Advanced Film Uniformity Analysis)
SEMI / ASTM F81 Half-Range & 1-Sigma Metrics Continuous Source LUB-2D
[1. 전체 웨이퍼 글로벌 통계 지표 (Global 300 mm Statistical Metrics)] Sample Density: 0–150 mm Spatial Array
Mean (평균 h̄)
184.3 µm
Median (중앙값)
182.6 µm
Minimum (h_min)
24.7 µm
r = 150 mm
Maximum (h_max)
742.1 µm
r = 0 mm
Range (Δh)
717.4 µm
h_max - h_min
Std Dev (표준편차 σ)
88.4 µm
Coeff. of Variation (CV)
47.9 %
(σ / h̄) × 100%
Uniformity (균일도)
82.5% (SEMI)
1-σ: 52.1%
[중심부 (Center Region)] r: 0~50 mm
• Avg Thickness: 517.7 µm
• Min / Max: 298.7 / 742.1 µm
• Std Dev (σ): 181.2 µm
• Uniformity: 72.3 %
[중간부 (Mid Region)] r: 50~100 mm
• Avg Thickness: 197.9 µm
• Min / Max: 112.3 / 298.7 µm
• Std Dev (σ): 76.1 µm
• Uniformity: 81.5 %
[외곽부 (Edge Region)] r: 100~150 mm
• Avg Thickness: 66.3 µm
• Min / Max: 24.7 / 112.3 µm
• Std Dev (σ): 35.8 µm
• Uniformity: 86.7 %
[웨이퍼 Edge 특화 평가] THINNER THAN AVERAGE
Edge(100~150mm) Avg: 66.3 µm
vs Wafer Avg(184.3 µm): -118.0 µm (-64.0%)
Classification: Edge < 95% h̄ (Centrifugal / Evaporative Thinning)
[3. 반경별 정밀 균일도 분포 (6-Zone Radial Uniformity Profile: 0–150 mm, 25mm Bins)] Area Weight: A_i = (r2² - r1²)/R²
Radial Zone Area Weight Mean Thickness (h̄_i) Zone Min / Max Range (Δh) Dev vs Wafer Avg (h̄_i - h̄) Zone Uniformity Relative Bar
[4. 노즐 배치-두께 편차 상관 분석 (Nozzle Spatial Correlation Analysis)] Objective Statistical Association & Continuous Source Footprints
📋 [300mm Wafer 액막 균일도 종합 공정 엔지니어링 해석 결론] SEMI E10 & Advanced Process Control (APC) Screening
🌀 무차원 수 유동 영역 해석 (Hydrodynamic Regime Map) Reduced-Order Engineering Regime Screening
Reynolds Number (Re)
1.45 × 10⁵
Re = ρVL / μ (Laminar)
Weber Number (Engineering Screening)
128.4
We = ρV²L / σ
Characteristic Scales (L, V)
Veff: 15.7 m/s | Lfilm: 24.7 µm
L = Local Film Thickness (h)
Dominant Regime Classification
INERTIA DOMINATED
High Re / Moderate We
[Hydrodynamic Regime Map (Re vs We)] Log-Log Screening
🔵 Viscous   🟢 Surface-Tension   🟡 Transition   🟠 Inertia   🟣 High-We
[반경별 무차원수 분포 (Radial Re & We Breakdown)] r = 0 ~ 150 mm
Radius (r) Film h (µm) Vel V (m/s) Re (Reynolds) We (Weber) Local Flow Regime
[무차원수 (Re & We) 공정 영향 한국어 해석 (Korean Engineering Interpretation)]
* Re and We are used as reduced-order engineering screening parameters and do not represent a full CFD solution.
📈 공정 시간 경과 특성 해석 (Process Time Evolution Analysis - V13.4-1) Time History, Stability & Event Overlay Engine
Process Stability State
TRANSIENT
|dh/dt|_max: 0.00 µm/s
Film Stabilization Time
Not Yet Stabilized
Threshold: |dh/dt| ≤ 0.30 µm/s
Dewetting Stabilization Time
Not Yet Stabilized
Threshold: |dRisk/dt| ≤ 0.01/s
Max Dewetting Risk & Marangoni
Risk: 0.00 | uM: 0.000
Wafer Peak Screening
Simulation Time Elapsed
0.0 s
History: 0 samples
Graph View:
Radial Curves:
⏱️ Process Timeline Events Log Auto-recorded step changes
No process events logged yet.
[공정 시간 경과 특성 종합 분석 및 제언 (Korean Engineering Conclusion)]
* Process Time Evolution Analysis records real-time radial film thickness, dewetting risk, Marangoni history, and process parameter transition events.
🧪 Marangoni Flow & Dewetting Risk Physical Screening (V13.3-4) Physical Risk Screening Chain | Reduced-Order Model
Max Surface-Tension Gradient (∇σ)
0.0 mN/m/mm
Chemical Boundary Gradient
Max Marangoni Velocity (u_M)
0.00 mm/s
Direction: Outward
Min Local Thinning Ratio (h/h_ref)
1.00
h_local vs Reference Film
Screening Risk Classification
WET (Stable)
Risk Index: 0.05
🔗 DEWETTING RISK CAUSALITY CHAIN (인과관계 체인 분석) 7-Stage Physical Sequence
STEP 1
🧪 Chem Mixing
IPA + DIW
STEP 2
⚡ Surf-Tension Grad
∇σ: 0.0 mN/m/mm
STEP 3
🌊 Marangoni Flow
u_M: 0.00 mm/s
STEP 4
🔄 Redistribution
Active Flow
STEP 5
📉 Film Thinning
h/h_ref: 1.00
STEP 6
⚠️ Stability Loss
Stable
STEP 7
🚨 Dewetting Risk
WET
📊 Radial Profile: Film Thickness, Marangoni Velocity & Dewetting Risk Index Radius: 0 mm (Center) ─── 150 mm (Wafer Edge)
🎯 NOZZLE CAUSE ANALYSIS (노즐별 비젖음 위험 기여도 원인 분석) Inspected Radius: 75 mm
Nozzle Nozzle Pos (x, y) Chemical Flow Rate Physical Weight Contribution (%) Primary Physical Function / Risk Role
[반경 위치별 Marangoni & Dewetting Screening Breakdown Table]
Radius (mm) Film h (µm) Surface Tension σ (mN/m) Gradient |∇σ| (mN/m/mm) u_M (mm/s) Ratio (h/h_ref) Risk Index (I_dewet) Risk State
[Marangoni 재분포 및 비젖음 위험(Dewetting Risk) 한국어 해석 (Korean Engineering Conclusion)]
⚠️ Scientific Model & Engineering Limitation:
Marangoni-induced dewetting is represented as a reduced-order stability screening model. Actual dewetting depends on wettability, contact angle, surface condition, chemical composition, film thickness, evaporation, temperature, surface-tension gradients and transient flow.
⚖️ V13.4-4 다목적 공정 최적화기 (Multi-Objective Process Optimizer)
Pareto Frontier & MCDM Engine 4-Objective Simultaneous Scoring
⚙️ [1. 다목적 가중치 제어 (User-Adjustable Objective Weights)]
Presets:
1. Film Uniformity 35%
Maximize Wafer-wide h̄ uniformity
2. Thickness Range 20%
Minimize peak-to-valley Δh
3. Dewetting Risk 25%
Minimize dry hole instability I_dewet
4. Marangoni Risk 20%
Minimize |u_M| & ∇σ tension shock
Auto-Normalized Weight Composition (Total = 100%): U: 35.0% | Range: 20.0% | Dewet: 25.0% | Marangoni: 20.0%
📈 Pareto Optimization Plot (X: Film Uniformity vs. Y: Dewetting Risk) Evaluated: 0 | Pareto Optimal: 0
• Legend: 💎 Pareto Front (Non-dominated) | ⭐ Best Balanced | ⭕ Current Baseline | 🔹 Candidates Click any point to select
★ BEST BALANCED CONDITION Rank 1
Candidate Flow Distribution:
N1: 1500 / N2: 1000 mL/min (60:40)
1. Uniformity
82.5%
2. Thickness Range
717.4 µm
3. Dewetting Risk
0.24
4. Marangoni Risk
3.12 mm/s
Engineering Optimization Score (Higher = Better)
84.6 / 100 pts
*Only modifies chamber settings upon clicking this button.
[4. 주요 공정 조건 후보군 비교 (Key Candidate Solutions Comparison Deck)] *Do not call "Absolute Optimal" because result depends on weights & model
[5. 상위 후보군 종합 평가표 (Top Ranked Multi-Objective Candidates Table)] Click row to inspect or apply
Rank Candidate Type Flow Distribution (mL/min) Uniformity (%) Range Δh (µm) Dewetting Risk Marangoni Risk Total Score Pareto Status Action
Press "Run Multi-Objective Optimizer" to evaluate candidate flow distributions across the 4 engineering objectives.
📋 [다목적 공정 최적화 종합 엔지니어링 해석 결론 (Korean Engineering Conclusion)]
다목적 최적화 탐색을 실행하여 4가지 공정 지표(Film Uniformity, Thickness Range, Dewetting Risk, Marangoni Risk)의 종합 가중치 평가 및 Pareto Front 해를 도출하십시오.
⚠️ Scientific Model & Engineering Limitation:
The optimization result is dependent on objective weights and the current reduced-order engineering model.
Multi-objective trade-off frontiers are computed based on 2D depth-integrated lubrication approximations (LUB-2D) and simplified Marangoni instability screening. Final recipe deployment should be validated with chamber metrology.
📁 V13.4-5 공정 조건 비교 분석기 (Process Case Comparison & Radial Overlay)
Snapshot & LocalStorage Persistence Up to 4-Case Radial Overlay
📸 [1. 현재 챔버 상태 스냅샷 저장 (Save Case Snapshot)]
Saved: 0 Cases
📋 [2. 저장된 공정 케이스 목록 (Case List & Compare Selection)] (Select up to 4 cases to compare) Selected: 0 / 4
Compare Tag Case Name & Time RPM / Temp Nozzle / Chem / Flow Uniformity Avg h̄ (µm) Dewet Risk Re / We Actions
No saved cases found. Click "Save Current State as Case" or "Reset Benchmark Presets".
📈 [3. 반경별 액막 두께 중첩 비교 곡선 (Radial Film Thickness Overlay: h(r) Curve Comparison)] Hover to inspect exact thickness at radius r
Radius r = 0 mm (Center) r = 75 mm (Mid) r = 150 mm (Edge / Bevel)
📍 Radial Probe Cursor
Radius: r = 75.0 mm
Active Compared Cases:
[4. 공정 조건 및 지표 다중 비교 분석표 (Side-by-Side Comprehensive Comparison)] Compared parameters & physics metrics (Up to 4 Cases)
📋 [공정 조건 비교 종합 엔지니어링 결론 (Korean Comparison Conclusion)]
비교할 케이스를 2개 이상 선택(체크)하면 각 조건 간 액막 균일도, Dewetting Risk, Marangoni 속도, Re/We 무차원 수의 정량적 비교 결론이 자동 산출됩니다.
ℹ️ Process Case Storage & Metrology Notice:
Cases are saved directly into browser LocalStorage. Loading a case restores the complete chamber state (RPM, Temperature, Nozzle geometry, and flow rates). All comparative values are calculated dynamically using the unified physical solver.
📑

300mm SEMICONDUCTOR PROCESS ENGINEERING ANALYSIS REPORT

Simulation Type: Reduced-Order Engineering Model Purpose: Relative Process Screening Target Wafer: 300 mm Silicon Wafer (R=150 mm) Doc ID: RPT-2026-0813-01
Data Classification Guide:
[CALCULATED VALUES] 수치 계산값 [ENGINEERING SCREENING] 스크리닝 지표 [INTERPRETATION] 공정 해석 및 가이드
1. Process Conditions (공정 운전 조건) CALCULATED VALUES
Wafer Rotation
1200 RPM
ω = 125.7 rad/s
Chamber Temp
25.0 °C
298.15 K
Active Nozzles
2 Arms
Multi-Arm Dispense
Total Chemical Flow
25.0 mL/s
1.50 L/min
Arm # Status Position (X, Y) Radius $r_N$ (mm) Chemical Species Flow Rate $\dot{Q}$ Dispense Ratio
2. Film Thickness & Uniformity (반경별 액막 두께 및 균일도) CALCULATED VALUES
Center h(0 mm)
642.0 µm
Stagnation core
Average Thickness h̄
510.4 µm
Radial mean
Minimum $h_{min}$
380.2 µm
at r = 150 mm
Maximum $h_{max}$
680.5 µm
at r = 10 mm
Edge h(150 mm)
380.2 µm
Bevel boundary
Film Uniformity (U)
89.4%
Δh = 300.3 µm
3. Hydrodynamics & Flow Regime (수력학적 무차원수 및 유동 영역) CALCULATED VALUES
Reynolds Number ($Re$)
2.83 × 10⁵
$Re = \rho \omega R^2 / \mu$ (Rotational)
Weber Number ($We$)
142.6
$We = \rho v^2 h / \sigma$ (Inertia / Capillary)
Ekman Boundary Layer Depth
89.2 µm
$\delta_E = \sqrt{\nu / \omega}$
Hydrodynamic Flow Regime
Laminar Ekman / Thin-Film
Centrifugal-dominated flow
4. Chemical & Surface Effects (화학종 혼합 및 계면 특성) ENGINEERING SCREENING
Chemical Blend / Species
DIW (60%) + IPA (40%)
μ: 1.00 mPa·s | ρ: 1000 kg/m³
Effective Surface Tension ($\sigma$)
42.5 mN/m
Max ∇σ: 1.25 mN/(m·mm)
Marangoni Peak Velocity ($u_M$)
3.42 mm/s
Outward surface shear
Solvent Evaporation Flux
0.082 g/(m²·s)
Thermal activation: 1.00×
5. Film Stability & Wetting Integrity (액막 안정성 및 젖음성 스크리닝) ENGINEERING SCREENING
Dewetting Risk Index ($I_{dewet}$)
0.24 (LOW RISK)
Threshold: < 0.35 (Safe)
Local Thinning Risk Level
STABLE (Δh < 350µm)
Dry spot vulnerability: Minimal
Non-Wetting / Edge Pinning
FULL COVERAGE (100%)
Wafer edge bevel wetness: Secured
Centrifugal Shear Margin
ADEQUATE
Radial drainage balanced with supply
📋 6. Engineering Conclusion & Actionable Recommendations (종합 엔지니어링 결론) INTERPRETATION
⚠️ Scientific Metrology Disclaimer & Verification Boundary Notice:
  • [Calculated Values (수치 계산값)]: 챔버 작동 파라미터(RPM, 온도, 노즐 좌표, 토출 유량) 및 1D/2D 정상상태 연속방정식·무차원수($Re, We$) 기반 결정론적 물리 수치입니다.
  • [Engineering Screening (엔지니어링 스크리닝)]: 삭감 차원 모델(Reduced-Order Engineering Model)에 기반하여 비젖음(Dewetting), 마랑고니 대류, 국소 박막화 위험도를 신속 스크리닝하기 위한 상대 비교 지표입니다.
  • [Interpretation (공정 해석)]: 공정 엔지니어의 레시피 튜닝을 보조하기 위한 모델 기반 추론 가이드입니다.
  • 중요 고지: 본 보고서에 제시된 스크리닝 결과는 실험적으로 최종 검증된 양산 장비 실측 예측값이 아니며, 공정 레시피 후보군 탐색 및 상대적 거동 비교(Relative Screening) 목적으로만 활용되어야 합니다.
🎯 Nozzle Position Optimizer (V13.3-5) Engineering Screening | Lightweight Reduced-Order Sweep
→
→
🗺️ Candidate Position Score Map & Top Ranking Comparison Candidates evaluated: 0
[Top 5 Candidate Position Sweep Results Table]
Rank X (mm) Y (mm) Uniformity (%) Thickness Range (µm) Dewetting Risk Score Action
Press "Run Nozzle Sweep" to evaluate candidate nozzle positions.
[노즐 위치 최적화 결과 및 공정 제언 (Korean Optimization Conclusion)]
탐색 버튼을 클릭하여 선택한 노즐 위치 범위에 대한 최적 배치 및 액막 품질 평가를 수행하십시오.
⚠️ Model Limitation: Optimization is based on the current reduced-order model and should be interpreted as engineering screening.
💧 Nozzle Flow Balance Optimizer (V13.3-6) Flow Ratio Distribution Sweep | Constant Total Flow
📊 Flow Rate Ratio vs. Film Uniformity & Optimization Score Chart Distributions tested: 0
[Top Candidate Flow Distribution Results Table]
Rank Flow Rates (mL/min) Flow Ratio (%) Uniformity (%) Thickness Range (µm) Dewetting Risk Score Action
Press "Run Flow Ratio Sweep" to evaluate candidate flow distributions.
[노즐 유량 분배 최적화 결과 및 공정 제언 (Korean Flow Optimization Conclusion)]
탐색 버튼을 클릭하여 총 유량 조건에 대한 노즐 간 최적 유량 분배 비율을 평가하십시오.
⚠️ Model Limitation: Flow distribution optimization is based on the current reduced-order film thickness and Marangoni stability screening model.
🔬 SCIENTIFIC MODEL & ENGINEERING LIMITATIONS (CLICK TO TOGGLE)

⚠️ Model Scope & Limitations

• Reduced-Order Model: Uses 2D depth-integrated lubrication approximation (LUB-2D).
• Not 3D CFD / VOF: Does not resolve 3D navier-stokes or explicit phase-volume tracking.
• Representative Properties: Chemical physical constants are reference baseline values.
• Reaction Kinetics: Multi-chemical reaction enthalpy or complex phase changes are not explicitly modeled.
• Equipment Calibration: Actual chamber matching requires empirical process calibration constants.

① Continuous Spin Film Equation

h(r) = [ 3μQ / (2πρω²) ]1/3 · r-2/3

Balance between centrifugal force and viscous shear stress in steady-state spin coating (Emslie, Bonner, Peck 1958).

② Viscosity Temperature Dependency

μ(T) = μ25 · exp( -B · (T - 25) )

Andrade viscosity fitting model for thermal processing effects.

③ Marangoni Screening Velocity

uM ≈ (h / 2μ) · ∇σ

Effective surface tension gradient flow screening model.