[Marangoni 재분포 및 비젖음 위험(Dewetting Risk) 한국어 해석 (Korean Engineering Conclusion)]
⚠️ Scientific Model & Engineering Limitation:
Marangoni-induced dewetting is represented as a reduced-order stability screening model.
Actual dewetting depends on wettability, contact angle, surface condition, chemical composition,
film thickness, evaporation, temperature, surface-tension gradients and transient flow.
⚖️V13.4-4 다목적 공정 최적화기 (Multi-Objective Process Optimizer)
📈Pareto Optimization Plot (X: Film Uniformity vs. Y: Dewetting Risk)Evaluated: 0 | Pareto Optimal: 0
• Legend: 💎 Pareto Front (Non-dominated) | ⭐ Best Balanced | ⭕ Current Baseline | 🔹 CandidatesClick any point to select
★ BEST BALANCED CONDITIONRank 1
Candidate Flow Distribution:
N1: 1500 / N2: 1000 mL/min (60:40)
1. Uniformity
82.5%
2. Thickness Range
717.4 µm
3. Dewetting Risk
0.24
4. Marangoni Risk
3.12 mm/s
Engineering Optimization Score (Higher = Better)
84.6 / 100 pts
*Only modifies chamber settings upon clicking this button.
[4. 주요 공정 조건 후보군 비교 (Key Candidate Solutions Comparison Deck)]*Do not call "Absolute Optimal" because result depends on weights & model
[5. 상위 후보군 종합 평가표 (Top Ranked Multi-Objective Candidates Table)]Click row to inspect or apply
Rank
Candidate Type
Flow Distribution (mL/min)
Uniformity (%)
Range Δh (µm)
Dewetting Risk
Marangoni Risk
Total Score
Pareto Status
Action
Press "Run Multi-Objective Optimizer" to evaluate candidate flow distributions across the 4 engineering objectives.
📋[다목적 공정 최적화 종합 엔지니어링 해석 결론 (Korean Engineering Conclusion)]
다목적 최적화 탐색을 실행하여 4가지 공정 지표(Film Uniformity, Thickness Range, Dewetting Risk, Marangoni Risk)의 종합 가중치 평가 및 Pareto Front 해를 도출하십시오.
⚠️ Scientific Model & Engineering Limitation:
The optimization result is dependent on objective weights and the current reduced-order engineering model.
Multi-objective trade-off frontiers are computed based on 2D depth-integrated lubrication approximations (LUB-2D) and simplified Marangoni instability screening. Final recipe deployment should be validated with chamber metrology.
📁V13.4-5 공정 조건 비교 분석기 (Process Case Comparison & Radial Overlay)
Snapshot & LocalStorage Persistence
Up to 4-Case Radial Overlay
📸 [1. 현재 챔버 상태 스냅샷 저장 (Save Case Snapshot)]
Saved: 0 Cases
📋 [2. 저장된 공정 케이스 목록 (Case List & Compare Selection)](Select up to 4 cases to compare)Selected: 0 / 4
Compare
Tag
Case Name & Time
RPM / Temp
Nozzle / Chem / Flow
Uniformity
Avg h̄ (µm)
Dewet Risk
Re / We
Actions
No saved cases found. Click "Save Current State as Case" or "Reset Benchmark Presets".
📈[3. 반경별 액막 두께 중첩 비교 곡선 (Radial Film Thickness Overlay: h(r) Curve Comparison)]Hover to inspect exact thickness at radius r
Radius r = 0 mm (Center)r = 75 mm (Mid)r = 150 mm (Edge / Bevel)
📍 Radial Probe Cursor
Radius: r = 75.0 mm
Active Compared Cases:
[4. 공정 조건 및 지표 다중 비교 분석표 (Side-by-Side Comprehensive Comparison)]
Compared parameters & physics metrics (Up to 4 Cases)
📋[공정 조건 비교 종합 엔지니어링 결론 (Korean Comparison Conclusion)]
비교할 케이스를 2개 이상 선택(체크)하면 각 조건 간 액막 균일도, Dewetting Risk, Marangoni 속도, Re/We 무차원 수의 정량적 비교 결론이 자동 산출됩니다.
ℹ️ Process Case Storage & Metrology Notice:
Cases are saved directly into browser LocalStorage. Loading a case restores the complete chamber state (RPM, Temperature, Nozzle geometry, and flow rates). All comparative values are calculated dynamically using the unified physical solver.
📑
300mm SEMICONDUCTOR PROCESS ENGINEERING ANALYSIS REPORT
Simulation Type:Reduced-Order Engineering ModelPurpose:Relative Process ScreeningTarget Wafer:300 mm Silicon Wafer (R=150 mm)Doc ID:RPT-2026-0813-01
[Calculated Values (수치 계산값)]: 챔버 작동 파라미터(RPM, 온도, 노즐 좌표, 토출 유량) 및 1D/2D 정상상태 연속방정식·무차원수($Re, We$) 기반 결정론적 물리 수치입니다.
[Engineering Screening (엔지니어링 스크리닝)]: 삭감 차원 모델(Reduced-Order Engineering Model)에 기반하여 비젖음(Dewetting), 마랑고니 대류, 국소 박막화 위험도를 신속 스크리닝하기 위한 상대 비교 지표입니다.
[Interpretation (공정 해석)]: 공정 엔지니어의 레시피 튜닝을 보조하기 위한 모델 기반 추론 가이드입니다.
중요 고지: 본 보고서에 제시된 스크리닝 결과는 실험적으로 최종 검증된 양산 장비 실측 예측값이 아니며, 공정 레시피 후보군 탐색 및 상대적 거동 비교(Relative Screening) 목적으로만 활용되어야 합니다.
🎯Nozzle Position Optimizer (V13.3-5)
Engineering Screening | Lightweight Reduced-Order Sweep
→
→
🗺️ Candidate Position Score Map & Top Ranking ComparisonCandidates evaluated: 0
[Top 5 Candidate Position Sweep Results Table]
Rank
X (mm)
Y (mm)
Uniformity (%)
Thickness Range (µm)
Dewetting Risk
Score
Action
Press "Run Nozzle Sweep" to evaluate candidate nozzle positions.
[노즐 위치 최적화 결과 및 공정 제언 (Korean Optimization Conclusion)]
탐색 버튼을 클릭하여 선택한 노즐 위치 범위에 대한 최적 배치 및 액막 품질 평가를 수행하십시오.
⚠️ Model Limitation:
Optimization is based on the current reduced-order model and should be interpreted as engineering screening.
💧Nozzle Flow Balance Optimizer (V13.3-6)
Flow Ratio Distribution Sweep | Constant Total Flow
📊 Flow Rate Ratio vs. Film Uniformity & Optimization Score ChartDistributions tested: 0
[Top Candidate Flow Distribution Results Table]
Rank
Flow Rates (mL/min)
Flow Ratio (%)
Uniformity (%)
Thickness Range (µm)
Dewetting Risk
Score
Action
Press "Run Flow Ratio Sweep" to evaluate candidate flow distributions.
[노즐 유량 분배 최적화 결과 및 공정 제언 (Korean Flow Optimization Conclusion)]
탐색 버튼을 클릭하여 총 유량 조건에 대한 노즐 간 최적 유량 분배 비율을 평가하십시오.
⚠️ Model Limitation:
Flow distribution optimization is based on the current reduced-order film thickness and Marangoni stability screening model.
🔬 SCIENTIFIC MODEL & ENGINEERING LIMITATIONS (CLICK TO TOGGLE)
⚠️ Model Scope & Limitations
• Reduced-Order Model: Uses 2D depth-integrated lubrication approximation (LUB-2D).
• Not 3D CFD / VOF: Does not resolve 3D navier-stokes or explicit phase-volume tracking.
• Representative Properties: Chemical physical constants are reference baseline values.
• Reaction Kinetics: Multi-chemical reaction enthalpy or complex phase changes are not explicitly modeled.
• Equipment Calibration: Actual chamber matching requires empirical process calibration constants.
① Continuous Spin Film Equation
h(r) = [ 3μQ / (2πρω²) ]1/3 · r-2/3
Balance between centrifugal force and viscous shear stress in steady-state spin coating (Emslie, Bonner, Peck 1958).
② Viscosity Temperature Dependency
μ(T) = μ25 · exp( -B · (T - 25) )
Andrade viscosity fitting model for thermal processing effects.