1. WAFER PLAN VIEW (300mm Top-View) Coordinate System: WAFER RELATIVE ℹ️
2. NOZZLE TRACE & FOOTPRINT Chamber Fixed Position | Wafer Trace: Circular
3. RADIAL FILM THICKNESS PROFILE
Cursor r: r: 75 mm | h: 182.6 µm
RADIAL CURSOR INSPECTOR (r = 75 mm) [Drag cursor on graph to inspect]
Radius 75 mm
Film Thickness 182.6 µm
Chemical Blend DIW 60 / IPA 40
Viscosity (μ) 1.15 cP
Surface Tension (σ) 58.2 mN/m
Flow Velocity (u) 84.5 mm/s
Reynolds No. (Re) 1.21 × 10⁶
Flow Regime Turbulent
Dewetting Status Stable
Marangoni Effect 0.042 mm/s
Center (0mm)
742.1 µm
25mm
512.4 µm
50mm
298.7 µm
75mm
182.6 µm
100mm
112.3 µm
125mm
61.8 µm
Edge (150mm)
24.7 µm
4. WAFER CROSS SECTION (Side View) Vertical thickness is visually amplified.
Max Thickness
742.1 µm
@ r (mm)
0.0
Edge Thickness
24.7 µm
Avg Thickness
184.3 µm
Re @ Edge
1.21 × 10⁶
Regime
Turbulent
💡 노즐 구조물을 좌우로 드래그하면 X 위치가 실시간 변경됩니다
MIXED PROPERTIES (Flow-Weighted)
ρmix: 0.91 g/cc
μmix: 1.47 cP
σmix: 55.3 mN/m
Local Equilibrium Properties
EDGE FORCE DOMINANCE
Centrifugal >> Viscous > Marangoni
Engineering Screening Indicator
EDGE EVAPORATION
LOW
Temp & RPM Screening Indicator
MARANGONI EFFECT
MEDIUM
uM Screening: 0.042 mm/s
MODEL CONFIDENCE
MEDIUM
Reduced-Order LUB-2D Model
📊 300mm Wafer 액막 두께 분석 (300mm Wafer Film Thickness Analysis) Continuous Source Representation & Reduced-Order Engineering Model
[공정 조건 (Process Conditions)]
• Spin Speed: 1000 RPM
• Discharge Temp: 25 °C
• Active Nozzles: 2 개
• Dispense Mode: Continuous Source
[액막 두께 산출 지표 (Film Thickness KPIs)]
Center (0mm): 742.1 µm
25 mm: 512.4 µm
50 mm: 298.7 µm
75 mm: 182.6 µm
100 mm: 112.3 µm
125 mm: 61.8 µm
Edge (150mm): 24.7 µm
Average: 184.3 µm
Maximum: 742.1 µm
Minimum: 24.7 µm
Uniformity: 82.5 %
[Nozzle 위치별 영역 영향 분석 (Nozzle Region Breakdown)]
[300mm Wafer 액막 두께 종합 공정 해석 결론]
🌀 무차원 수 유동 영역 해석 (Hydrodynamic Regime Map) Reduced-Order Engineering Regime Screening
Reynolds Number (Re)
1.45 × 10⁵
Re = ρVL / μ (Laminar)
Weber Number (Engineering Screening)
128.4
We = ρV²L / σ
Characteristic Scales (L, V)
Veff: 15.7 m/s | Lfilm: 24.7 µm
L = Local Film Thickness (h)
Dominant Regime Classification
INERTIA DOMINATED
High Re / Moderate We
[Hydrodynamic Regime Map (Re vs We)] Log-Log Screening
🔵 Viscous   🟢 Surface-Tension   🟡 Transition   🟠 Inertia   🟣 High-We
[반경별 무차원수 분포 (Radial Re & We Breakdown)] r = 0 ~ 150 mm
Radius (r) Film h (µm) Vel V (m/s) Re (Reynolds) We (Weber) Local Flow Regime
[무차원수 (Re & We) 공정 영향 한국어 해석 (Korean Engineering Interpretation)]
* Re and We are used as reduced-order engineering screening parameters and do not represent a full CFD solution.
📈 공정 시간 경과 특성 해석 (Process Time Evolution Analysis - V13.4-1) Time History, Stability & Event Overlay Engine
Process Stability State
TRANSIENT
|dh/dt|_max: 0.00 µm/s
Film Stabilization Time
Not Yet Stabilized
Threshold: |dh/dt| ≤ 0.30 µm/s
Dewetting Stabilization Time
Not Yet Stabilized
Threshold: |dRisk/dt| ≤ 0.01/s
Max Dewetting Risk & Marangoni
Risk: 0.00 | uM: 0.000
Wafer Peak Screening
Simulation Time Elapsed
0.0 s
History: 0 samples
Graph View:
Radial Curves:
⏱️ Process Timeline Events Log Auto-recorded step changes
No process events logged yet.
[공정 시간 경과 특성 종합 분석 및 제언 (Korean Engineering Conclusion)]
* Process Time Evolution Analysis records real-time radial film thickness, dewetting risk, Marangoni history, and process parameter transition events.
🧪 Marangoni Flow & Dewetting Risk Physical Screening (V13.3-4) Physical Risk Screening Chain | Reduced-Order Model
Max Surface-Tension Gradient (∇σ)
0.0 mN/m/mm
Chemical Boundary Gradient
Max Marangoni Velocity (u_M)
0.00 mm/s
Direction: Outward
Min Local Thinning Ratio (h/h_ref)
1.00
h_local vs Reference Film
Screening Risk Classification
WET (Stable)
Risk Index: 0.05
🔗 DEWETTING RISK CAUSALITY CHAIN (인과관계 체인 분석) 7-Stage Physical Sequence
STEP 1
🧪 Chem Mixing
IPA + DIW
STEP 2
⚡ Surf-Tension Grad
∇σ: 0.0 mN/m/mm
STEP 3
🌊 Marangoni Flow
u_M: 0.00 mm/s
STEP 4
🔄 Redistribution
Active Flow
STEP 5
📉 Film Thinning
h/h_ref: 1.00
STEP 6
⚠️ Stability Loss
Stable
STEP 7
🚨 Dewetting Risk
WET
📊 Radial Profile: Film Thickness, Marangoni Velocity & Dewetting Risk Index Radius: 0 mm (Center) ─── 150 mm (Wafer Edge)
🎯 NOZZLE CAUSE ANALYSIS (노즐별 비젖음 위험 기여도 원인 분석) Inspected Radius: 75 mm
Nozzle Nozzle Pos (x, y) Chemical Flow Rate Physical Weight Contribution (%) Primary Physical Function / Risk Role
[반경 위치별 Marangoni & Dewetting Screening Breakdown Table]
Radius (mm) Film h (µm) Surface Tension σ (mN/m) Gradient |∇σ| (mN/m/mm) u_M (mm/s) Ratio (h/h_ref) Risk Index (I_dewet) Risk State
[Marangoni 재분포 및 비젖음 위험(Dewetting Risk) 한국어 해석 (Korean Engineering Conclusion)]
⚠️ Scientific Model & Engineering Limitation:
Marangoni-induced dewetting is represented as a reduced-order stability screening model. Actual dewetting depends on wettability, contact angle, surface condition, chemical composition, film thickness, evaporation, temperature, surface-tension gradients and transient flow.
🎯 Nozzle Position Optimizer (V13.3-5) Engineering Screening | Lightweight Reduced-Order Sweep
→
→
🗺️ Candidate Position Score Map & Top Ranking Comparison Candidates evaluated: 0
[Top 5 Candidate Position Sweep Results Table]
Rank X (mm) Y (mm) Uniformity (%) Thickness Range (µm) Dewetting Risk Score Action
Press "Run Nozzle Sweep" to evaluate candidate nozzle positions.
[노즐 위치 최적화 결과 및 공정 제언 (Korean Optimization Conclusion)]
탐색 버튼을 클릭하여 선택한 노즐 위치 범위에 대한 최적 배치 및 액막 품질 평가를 수행하십시오.
⚠️ Model Limitation: Optimization is based on the current reduced-order model and should be interpreted as engineering screening.
💧 Nozzle Flow Balance Optimizer (V13.3-6) Flow Ratio Distribution Sweep | Constant Total Flow
📊 Flow Rate Ratio vs. Film Uniformity & Optimization Score Chart Distributions tested: 0
[Top Candidate Flow Distribution Results Table]
Rank Flow Rates (mL/min) Flow Ratio (%) Uniformity (%) Thickness Range (µm) Dewetting Risk Score Action
Press "Run Flow Ratio Sweep" to evaluate candidate flow distributions.
[노즐 유량 분배 최적화 결과 및 공정 제언 (Korean Flow Optimization Conclusion)]
탐색 버튼을 클릭하여 총 유량 조건에 대한 노즐 간 최적 유량 분배 비율을 평가하십시오.
⚠️ Model Limitation: Flow distribution optimization is based on the current reduced-order film thickness and Marangoni stability screening model.
🔬 SCIENTIFIC MODEL & ENGINEERING LIMITATIONS (CLICK TO TOGGLE)

⚠️ Model Scope & Limitations

• Reduced-Order Model: Uses 2D depth-integrated lubrication approximation (LUB-2D).
• Not 3D CFD / VOF: Does not resolve 3D navier-stokes or explicit phase-volume tracking.
• Representative Properties: Chemical physical constants are reference baseline values.
• Reaction Kinetics: Multi-chemical reaction enthalpy or complex phase changes are not explicitly modeled.
• Equipment Calibration: Actual chamber matching requires empirical process calibration constants.

① Continuous Spin Film Equation

h(r) = [ 3μQ / (2πρω²) ]1/3 · r-2/3

Balance between centrifugal force and viscous shear stress in steady-state spin coating (Emslie, Bonner, Peck 1958).

② Viscosity Temperature Dependency

μ(T) = μ25 · exp( -B · (T - 25) )

Andrade viscosity fitting model for thermal processing effects.

③ Marangoni Screening Velocity

uM ≈ (h / 2μ) · ∇σ

Effective surface tension gradient flow screening model.